Samsung Launches New Research Lab to Pioneer Next-Gen 3D DRAM

Samsung, the world’s largest memory chip manufacturer, has established a new research laboratory in the United States dedicated to advancing the development of next-generation three-dimensional (3D) DRAM, as reported by industry sources on Sunday. The lab operates under Device Solutions America (DSA) in Silicon Valley, overseeing Samsung’s semiconductor production in the US. Its primary objective is to create an enhanced DRAM model, positioning Samsung as a leader in the global 3D memory chip market. Samsung had previously announced plans for new 3D structures for sub-10-nanometer DRAM in October, enabling larger single-chip capacities exceeding 100 gigabits. Despite a challenging year for the semiconductor industry, with an 8.8% decline in revenue in 2023, artificial intelligence emerged as a positive driver for the sector. Samsung, affected by the overall memory market slowdown, reported a 38% year-on-year decline in revenue, primarily influenced by soft demand in the PC, server, and smartphone segments, along with oversupply and excess inventory across the market.