Goldmedal Electricals has introduced the I-Power Travel Adapter, a rechargeable plug charger designed for convenient and rapid device charging anywhere and anytime. As a prominent player in India’s Fast Moving Electrical Goods (FMEG) sector, Goldmedal Electricals aims to provide a cutting-edge solution for global connectivity through this innovative product. The I-Power Travel Adapter is a compact and practical charging option, …
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Alphabet’s Moonshot X Lab Trims Workforce, Seeks External Support
Alphabet’s innovative lab, X, is downsizing its workforce and seeking external investors to support its ventures. The division, known for tackling challenges like climate change and connectivity, is engaging in funding discussions with venture capitalists and adopting a new structure to facilitate the independent spin-out of projects as startups. Astro Teller, leading the lab, highlighted a shift towards collaborating with a …
Read More »Equinix Unveils Fabric Cloud Router, a Virtual Routing Innovation
Equinix has unveiled the Equinix Fabric Cloud Router, a new virtual routing service designed to simplify application and data connectivity across diverse cloud environments and on-premise setups. This solution streamlines complex cloud-to-cloud and hybrid cloud networking challenges, offering an easily configurable, enterprise-grade, multi-cloud routing service that can be deployed within minutes. Leveraging Equinix’s secure private connectivity, this service enables customers …
Read More »Deloitte Bolsters Scalable Digital Engineering Capabilities Through Acquisition of Giant Machines
Deloitte has announced its acquisition of Giant Machines, a strategic engineering firm, to enhance its digital engineering capabilities. The move aims to address the challenge of guiding clients from conceptualization to the actual development of digital products. Tim Juravich, a principal at Deloitte Consulting, highlighted the unique difficulties clients face in transitioning between technologies and platforms, emphasizing the need for …
Read More »Microsoft Unveils Latest Partner Benefit Packages
Microsoft has introduced new partner benefits packages, catering to solution providers at various growth stages. The packages include access to Microsoft Sales Copilot, product licenses, Azure credits, and more. The three packages—Partner Launch Benefits, Partner Success Core Benefits, and Partner Success Expanded Benefits—aim to support partners’ growth, aligning with Microsoft’s focus on AI workloads. With availability starting in major markets, …
Read More »National Quantum Mission Initiates Call for Pre-proposals to Establish T-Hubs
The National Quantum Mission (NQM) achieved a significant milestone with the launch of a call for pre-proposals to establish Thematic Hubs (T-Hubs). Secretary of the Department of Science and Technology (DST), Professor Abhay Karandikar, initiated the call on January 20, 2024, during the 9th edition of the India International Science Festival. The pre-proposal invites academic institutions and R&D labs to …
Read More »Union Minister Dr. Jitendra Singh Credits National Institutes for Shri Ram Mandir Construction
The construction of the Shri Ram Mandir has received technical assistance from four prominent National Institutes under CSIR (Council of Scientific & Industrial Research) and DST (Department of Science & Technology) as part of the Ministry of Science & Technology. Union Minister Dr. Jitendra Singh revealed that institutions like IITs and ISRO have also contributed to the project. Notably, CSIR-Central …
Read More »Staqu’s AI-Powered Surveillance Enhances Security Measures for Ayodhya Ram Mandir Inauguration
The forthcoming inauguration of the Ayodhya Ram Mandir on January 22, 2024, is poised for heightened security with the integration of AI-powered surveillance by Staqu Technologies. As a pioneer in AI implementation in India, Staqu is set to fortify security around key locations in Ayodhya, employing its innovative JARVIS audio and video analytics software. Atul Rai, Co-Founder & CEO of …
Read More »Foxconn and HCL Group Form Partnership for Chip Packaging and Testing Venture
Foxconn and HCL Group have joined forces to establish a chip packaging and testing venture in India, representing a significant collaboration aimed at advancing semiconductor capabilities in the country. Foxconn is set to invest $37.2 million, securing a 40% stake in the new venture, known as OSAT (outsourced semiconductor assembly and test) in industry terms. This strategic partnership follows Foxconn’s …
Read More »Kyndryl Introduces Services Orchestration Empowered by GenAI
Kyndryl, a global IT infrastructure services provider, has introduced its Kyndryl Workflow Orchestration services, a generative AI-powered technology aimed at enhancing service delivery and empowering customers to optimize their own services. This initiative utilizes no-code and low-code platforms to maximize business value for customers, moving beyond conventional IT optimization. Kyndryl aims to streamline business processes with a focus on improving …
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